FX PCB Co., Ltd. Ceramic PCB Manufacturer

Description
Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND EXPANSION, Aluminum PCB (AI203) is the most popular ceramic material for Ceramic PCB. Meanwhile, the price is cheaper than the ALN and Beo. Alumina Ceramic PCB Materials datasheet: Item - Unit - Value - Test Standard Color / White 3.2 Density g/cm³ ≥ 3.7 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598 Dielectric Constant 1MHz 9~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 350 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.2~0.75 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹⁴ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 6.5~7.5 GB/T 5593 Even though the ALN PCB will be more expensive than the AI203, ALN has high conductivity, and the expansion coefficient matches Si, which makes the customers still choose it as the material for their products, here you can see the details for the ALN material properties Alumina Nitride Ceramic PCB Datasheet: Item - Unit - Value - Test Standard Color / Gray 3.2 Density g/cm³ ≥ 3.33 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 170 GB/T 5598 Dielectric Constant 1MHz 8~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 450 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.3~0.6 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 2~3 GB/T 5593 The Technology for The Ceramic Circuit Board There are four kinds of technologies: LTCC (Low-temperature Co-fired Ceramic), HTCC (High-temperature Co-fired Ceramic), DBC (Direct Bonded Copper), and DPC (Direct Plate Copper). It is the thick film technology for LTCC and HTCC, and it will have the problem of poor thermal conductivity, bad precision of the trace, and a surface that is not smooth. If you want to know more details about this technology, you can read here DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB is using the DPC technology for all of our orders. Click here to get more Ceramic technology from us What’s the FX PCB Ceramic PCB capability? As a Ceramic PCB Supplier in China, we can support our customers from prototype to mass production. we are not only focusing on single-layer boards but also Multilayer circuit boards. Specification - Value Board Thickness (mm) 0.25/0.38/0.5/0.635/ 1.0/1.5/2.0/2.5/3.0m m Layer Number 1-2L Base Copper Thickness (µm) 18-300µm (0.5-8.5oz) Min Track Width/Space (mm) 0.075mm Min Hole Size 0.06mm (PTH) Finished Hole Tolerance (mm) 0.05mm (NPTH) Outline Tolerance (mm) 0.05mm Hole Tolerance ±0.05mm Min Space from Track to Board Edge 0.2mm Finished Board Thickness (0.25-0.38mm) ±0.03mm (0.38-0.635mm) ±0.04mm (0.76-2mm) ±0.05mm Surface Treatment ENIG, ENEPIG, Immersion Silver Material ALN, AI203 FX Ceramic PCB Manufacturing Process IQC(incoming material check), Laser Drill, PVD, Plating, Pattern, Etching, QC 1, Soldermask, Silkscreen, Surface treatment, Test, CNC by laser, FQC, Package, Shipping Ceramic PCB VS Fr4 Material Better thermal expansion Stronger and lower resistance metal film Good solderability of the substrate and high operating temperature 5, Good insulation, and Low High-frequency loss High-density assembly possible It has a long life and high reliability in aerospace as it does not contain organic ingredients and is resistant to cosmic rays What kind of fields that the Ceramic PCB can be used in? The ceramic circuit board is primarily used in the LED field, high-power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, components, high-frequency switching power supplies, automotive electronics, communications, aerospace, and military electronic components What kind of PCB files can FX PCB accept? Gerber file, Cam, Eagle file, CAD, Protel99, 99se, DXP If you are looking for a Ceramic PCB Manufacturer in China, please contact us by email now!
Request a Quote
Description
Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND EXPANSION, Aluminum PCB (AI203) is the most popular ceramic material for Ceramic PCB. Meanwhile, the price is cheaper than the ALN and Beo. Alumina Ceramic PCB Materials datasheet: Item - Unit - Value - Test Standard Color / White 3.2 Density g/cm³ ≥ 3.7 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598 Dielectric Constant 1MHz 9~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 350 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.2~0.75 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹⁴ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 6.5~7.5 GB/T 5593 Even though the ALN PCB will be more expensive than the AI203, ALN has high conductivity, and the expansion coefficient matches Si, which makes the customers still choose it as the material for their products, here you can see the details for the ALN material properties Alumina Nitride Ceramic PCB Datasheet: Item - Unit - Value - Test Standard Color / Gray 3.2 Density g/cm³ ≥ 3.33 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 170 GB/T 5598 Dielectric Constant 1MHz 8~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 450 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.3~0.6 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 2~3 GB/T 5593 The Technology for The Ceramic Circuit Board There are four kinds of technologies: LTCC (Low-temperature Co-fired Ceramic), HTCC (High-temperature Co-fired Ceramic), DBC (Direct Bonded Copper), and DPC (Direct Plate Copper). It is the thick film technology for LTCC and HTCC, and it will have the problem of poor thermal conductivity, bad precision of the trace, and a surface that is not smooth. If you want to know more details about this technology, you can read here DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB is using the DPC technology for all of our orders. Click here to get more Ceramic technology from us What’s the FX PCB Ceramic PCB capability? As a Ceramic PCB Supplier in China, we can support our customers from prototype to mass production. we are not only focusing on single-layer boards but also Multilayer circuit boards. Specification - Value Board Thickness (mm) 0.25/0.38/0.5/0.635/ 1.0/1.5/2.0/2.5/3.0m m Layer Number 1-2L Base Copper Thickness (µm) 18-300µm (0.5-8.5oz) Min Track Width/Space (mm) 0.075mm Min Hole Size 0.06mm (PTH) Finished Hole Tolerance (mm) 0.05mm (NPTH) Outline Tolerance (mm) 0.05mm Hole Tolerance ±0.05mm Min Space from Track to Board Edge 0.2mm Finished Board Thickness (0.25-0.38mm) ±0.03mm (0.38-0.635mm) ±0.04mm (0.76-2mm) ±0.05mm Surface Treatment ENIG, ENEPIG, Immersion Silver Material ALN, AI203 FX Ceramic PCB Manufacturing Process IQC(incoming material check), Laser Drill, PVD, Plating, Pattern, Etching, QC 1, Soldermask, Silkscreen, Surface treatment, Test, CNC by laser, FQC, Package, Shipping Ceramic PCB VS Fr4 Material Better thermal expansion Stronger and lower resistance metal film Good solderability of the substrate and high operating temperature 5, Good insulation, and Low High-frequency loss High-density assembly possible It has a long life and high reliability in aerospace as it does not contain organic ingredients and is resistant to cosmic rays What kind of fields that the Ceramic PCB can be used in? The ceramic circuit board is primarily used in the LED field, high-power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, components, high-frequency switching power supplies, automotive electronics, communications, aerospace, and military electronic components What kind of PCB files can FX PCB accept? Gerber file, Cam, Eagle file, CAD, Protel99, 99se, DXP If you are looking for a Ceramic PCB Manufacturer in China, please contact us by email now!
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Ceramic PCB Manufacturer -  - FX PCB Co., Ltd.
Shenzhen, Guangdong, China
Ceramic PCB Manufacturer
Ceramic PCB Manufacturer
Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND EXPANSION, Aluminum PCB (AI203) is the most popular ceramic material for Ceramic PCB. Meanwhile, the price is cheaper than the ALN and Beo. Alumina Ceramic PCB Materials datasheet: Item - Unit - Value - Test Standard Color / White 3.2 Density g/cm³ ≥ 3.7 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598 Dielectric Constant 1MHz 9~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 350 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.2~0.75 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹⁴ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 6.5~7.5 GB/T 5593 Even though the ALN PCB will be more expensive than the AI203, ALN has high conductivity, and the expansion coefficient matches Si, which makes the customers still choose it as the material for their products, here you can see the details for the ALN material properties Alumina Nitride Ceramic PCB Datasheet: Item - Unit - Value - Test Standard Color / Gray 3.2 Density g/cm³ ≥ 3.33 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 170 GB/T 5598 Dielectric Constant 1MHz 8~10 GB/T 5594.4 Dielectric Strength KV/mm ≥ 17 GB/T 5593 Flexural Strength Mpa ≥ 450 GB/T 5593 Camber Length‰ ≤ 2‰ Surface Roughness Ra μ m 0.3~0.6 GB/T 6062 Water Absorption % 0 GB/T 3299-1996 Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5 Thermal Expansion 10⁻⁶ mm 20~300℃ 2~3 GB/T 5593 The Technology for The Ceramic Circuit Board There are four kinds of technologies: LTCC (Low-temperature Co-fired Ceramic), HTCC (High-temperature Co-fired Ceramic), DBC (Direct Bonded Copper), and DPC (Direct Plate Copper). It is the thick film technology for LTCC and HTCC, and it will have the problem of poor thermal conductivity, bad precision of the trace, and a surface that is not smooth. If you want to know more details about this technology, you can read here DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB is using the DPC technology for all of our orders. Click here to get more Ceramic technology from us What’s the FX PCB Ceramic PCB capability? As a Ceramic PCB Supplier in China, we can support our customers from prototype to mass production. we are not only focusing on single-layer boards but also Multilayer circuit boards. Specification - Value Board Thickness (mm) 0.25/0.38/0.5/0.635/ 1.0/1.5/2.0/2.5/3.0m m Layer Number 1-2L Base Copper Thickness (µm) 18-300µm (0.5-8.5oz) Min Track Width/Space (mm) 0.075mm Min Hole Size 0.06mm (PTH) Finished Hole Tolerance (mm) 0.05mm (NPTH) Outline Tolerance (mm) 0.05mm Hole Tolerance ±0.05mm Min Space from Track to Board Edge 0.2mm Finished Board Thickness (0.25-0.38mm) ±0.03mm (0.38-0.635mm) ±0.04mm (0.76-2mm) ±0.05mm Surface Treatment ENIG, ENEPIG, Immersion Silver Material ALN, AI203 FX Ceramic PCB Manufacturing Process IQC(incoming material check), Laser Drill, PVD, Plating, Pattern, Etching, QC 1, Soldermask, Silkscreen, Surface treatment, Test, CNC by laser, FQC, Package, Shipping Ceramic PCB VS Fr4 Material Better thermal expansion Stronger and lower resistance metal film Good solderability of the substrate and high operating temperature 5, Good insulation, and Low High-frequency loss High-density assembly possible It has a long life and high reliability in aerospace as it does not contain organic ingredients and is resistant to cosmic rays What kind of fields that the Ceramic PCB can be used in? The ceramic circuit board is primarily used in the LED field, high-power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, components, high-frequency switching power supplies, automotive electronics, communications, aerospace, and military electronic components What kind of PCB files can FX PCB accept? Gerber file, Cam, Eagle file, CAD, Protel99, 99se, DXP If you are looking for a Ceramic PCB Manufacturer in China, please contact us by email now!

Description

What is the Ceramic PCB Substrate?

FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference:

BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND EXPANSION, Aluminum PCB (AI203) is the most popular ceramic material for Ceramic PCB. Meanwhile, the price is cheaper than the ALN and Beo.


Alumina Ceramic PCB Materials datasheet:


Item - Unit - Value - Test Standard
Color / White 3.2
Density g/cm³ ≥ 3.7 GB/T 2413
Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598
Dielectric Constant 1MHz 9~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 350 GB/T 5593
Camber Length‰ ≤ 2‰
Surface Roughness Ra μ m 0.2~0.75 GB/T 6062
Water Absorption % 0 GB/T 3299-1996
Volume Resistivity 20℃, Ω .cm ≥ 10¹⁴ GB/T 5594.5
Thermal Expansion 10⁻⁶ mm 20~300℃ 6.5~7.5 GB/T 5593

Even though the ALN PCB will be more expensive than the AI203, ALN has high conductivity, and the expansion coefficient matches Si, which makes the customers still choose it as the material for their products, here you can see the details for the ALN material properties


Alumina Nitride Ceramic PCB Datasheet:


Item - Unit - Value - Test Standard
Color / Gray 3.2
Density g/cm³ ≥ 3.33 GB/T 2413
Thermal Conductivity 20℃, W/(m • K) ≥ 170 GB/T 5598
Dielectric Constant 1MHz 8~10 GB/T 5594.4
Dielectric Strength KV/mm ≥ 17 GB/T 5593
Flexural Strength Mpa ≥ 450 GB/T 5593
Camber Length‰ ≤ 2‰
Surface Roughness Ra μ m 0.3~0.6 GB/T 6062
Water Absorption % 0 GB/T 3299-1996
Volume Resistivity 20℃, Ω .cm ≥ 10¹³ GB/T 5594.5
Thermal Expansion 10⁻⁶ mm 20~300℃ 2~3 GB/T 5593

The Technology for The Ceramic Circuit Board


There are four kinds of technologies: LTCC (Low-temperature Co-fired Ceramic), HTCC (High-temperature Co-fired Ceramic), DBC (Direct Bonded Copper), and DPC (Direct Plate Copper). It is the thick film technology for LTCC and HTCC, and it will have the problem of poor thermal conductivity, bad precision of the trace, and a surface that is not smooth. If you want to know more details about this technology, you can read here

DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB is using the DPC technology for all of our orders. Click here to get more Ceramic technology from us


What’s the FX PCB Ceramic PCB capability?


As a Ceramic PCB Supplier in China, we can support our customers from prototype to mass production. we are not only focusing on single-layer boards but also Multilayer circuit boards.


Specification - Value
Board Thickness (mm) 0.25/0.38/0.5/0.635/1.0/1.5/2.0/2.5/3.0mm
Layer Number 1-2L
Base Copper Thickness (µm) 18-300µm (0.5-8.5oz)
Min Track Width/Space (mm) 0.075mm
Min Hole Size 0.06mm (PTH)
Finished Hole Tolerance (mm) 0.05mm (NPTH)
Outline Tolerance (mm) 0.05mm
Hole Tolerance ±0.05mm
Min Space from Track to Board Edge 0.2mm
Finished Board Thickness (0.25-0.38mm) ±0.03mm
(0.38-0.635mm) ±0.04mm
(0.76-2mm) ±0.05mm
Surface Treatment ENIG, ENEPIG, Immersion Silver
Material ALN, AI203

FX Ceramic PCB Manufacturing Process


IQC(incoming material check), Laser Drill, PVD, Plating, Pattern, Etching, QC 1, Soldermask, Silkscreen, Surface treatment, Test, CNC by laser, FQC, Package, Shipping


Ceramic PCB VS Fr4 Material


  • Better thermal expansion
  • Stronger and lower resistance metal film
  • Good solderability of the substrate and high operating temperature 5, Good insulation, and Low High-frequency loss
  • High-density assembly possible
  • It has a long life and high reliability in aerospace as it does not contain organic ingredients and is resistant to cosmic rays

What kind of fields that the Ceramic PCB can be used in?


The ceramic circuit board is primarily used in the LED field, high-power semiconductor modules, semiconductor coolers, electronic heaters, power control circuits, power hybrid circuits, components, high-frequency switching power supplies, automotive electronics, communications, aerospace, and military electronic components


What kind of PCB files can FX PCB accept?


Gerber file, Cam, Eagle file, CAD, Protel99, 99se, DXP

If you are looking for a Ceramic PCB Manufacturer in China, please contact us by email now!

Supplier's Site

Technical Specifications

  FX PCB Co., Ltd.
Product Category Printed Circuit Substrate Materials (PCB / PWB)
Product Name Ceramic PCB Manufacturer
Materials ALN, AI203
Unlock Full Specs
to access all available technical data

Similar Products

Aluminum Nitride PCB Manufacturer in China -  - FX PCB Co., Ltd.
Specs
Materials AIN, AI203
Thickness 0.0150 to 0.1181 inches (0.3800 to 3 mm)
Resistivity 10 ohm-cm
View Details
FLEX PCB 6 -  - FX PCB Co., Ltd.
FX PCB Co., Ltd.
Specs
Type Film / Flexible
Materials PI
Thickness 0.0079 inches (0.2000 mm)
View Details
400W/MK Copper Base PCB -  - FX PCB Co., Ltd.
Specs
Materials Aluminum Foil; Copper Foil; Domestic Aluminum,Domestic copper,lmported aluminum, lmported copper
Thickness 0.0197 to 0.1969 inches (0.5000 to 5 mm)
View Details