The XPm2010 is a PICMG 2.11 power supply that takes in a MIL-STD-704 28 VDC input voltage and provides up to 300 W on 3.3 V, 5 V, and ±12 V at up to 90% efficiency. The XPm2010 also provides on-card MIL-STD-461E EMI filtering.
The XPm2010 fits in a 3U cPCI slot. Up to 8.3 A on 12 V, 2 A on -12 V, 22 A on 5 V, and 25 A on 3.3 V can be supported on each rail, separately. The XPm2010 can provide up to a combined 300 W of total output power at maximum operating temperature.
The XPm2010 features an optional VITA 46.11 Tier 1 and Tier 2 Intelligent Platform Management Interface (IPMI) controller, which monitors board voltages and temperatures.
Features
MIL-STD-704 28 VDC input voltage
MIL-STD-461E EMI filtering
PICMG 2.11 standard 47-position connector
Up to 300 W output on 3.3 V, 5 V, and ±12 V
On-card holdup capacitor for up to 40 ms (120 W symmetrical load distribution) of holdup time (optional)
Up to 90% efficient
-40°C to 85°C conduction-cooled operating temperature (at the thermal interface)
Compliant to the VITA 48.2 Type 1, Two-Level Maintenance (2LM) standard
VITA 46.11 Tier 1 and Tier 2 IPMI controller for on-card voltage monitoring (optional)
Technical Specs
Input Power
MIL-STD-704 28 VDC (22 to 29 V)
MIL-STD-461E EMI filtering
Output Power
Up to 90% efficient
Supports up to 300 W in total combined power output
3.3 V at up to 25 A
5 V at up to 22 A
12 V at up to 8.3 A
-12 V at up to 2 A
Holdup
On-card holdup capacitor for up to 40 ms (120 W symmetrical load distribution) of holdup time (optional)
Physical Characteristics
Contact factory for CAD model if desired
3U cPCI form factor
PICMG 2.11 standard 47-position connector
0.8 in. pitch
1.45 pounds (with on-card holdup capacitor)
1.1 pounds (without on-card holdup capacitor)
IPMI Controller (Optional)
VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
Monitors voltages
Monitors temperature sensors
Connects to backplane via system management bus (I²C)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
Conformal coating available as an ordering option
The XPm2010 is a PICMG 2.11 power supply that takes in a MIL-STD-704 28 VDC input voltage and provides up to 300 W on 3.3 V, 5 V, and ±12 V at up to 90% efficiency. The XPm2010 also provides on-card MIL-STD-461E EMI filtering.
The XPm2010 fits in a 3U cPCI slot. Up to 8.3 A on 12 V, 2 A on -12 V, 22 A on 5 V, and 25 A on 3.3 V can be supported on each rail, separately. The XPm2010 can provide up to a combined 300 W of total output power at maximum operating temperature.
The XPm2010 features an optional VITA 46.11 Tier 1 and Tier 2 Intelligent Platform Management Interface (IPMI) controller, which monitors board voltages and temperatures.
Features
- MIL-STD-704 28 VDC input voltage
- MIL-STD-461E EMI filtering
- PICMG 2.11 standard 47-position connector
- Up to 300 W output on 3.3 V, 5 V, and ±12 V
- On-card holdup capacitor for up to 40 ms (120 W symmetrical load distribution) of holdup time (optional)
- Up to 90% efficient
- -40°C to 85°C conduction-cooled operating temperature (at the thermal interface)
- Compliant to the VITA 48.2 Type 1, Two-Level Maintenance (2LM) standard
- VITA 46.11 Tier 1 and Tier 2 IPMI controller for on-card voltage monitoring (optional)
Technical Specs
Input Power
- MIL-STD-704 28 VDC (22 to 29 V)
- MIL-STD-461E EMI filtering
Output Power
- Up to 90% efficient
- Supports up to 300 W in total combined power output
- 3.3 V at up to 25 A
- 5 V at up to 22 A
- 12 V at up to 8.3 A
- -12 V at up to 2 A
Holdup
- On-card holdup capacitor for up to 40 ms (120 W symmetrical load distribution) of holdup time (optional)
Physical Characteristics
Contact factory for CAD model if desired
- 3U cPCI form factor
- PICMG 2.11 standard 47-position connector
- 0.8 in. pitch
- 1.45 pounds (with on-card holdup capacitor)
- 1.1 pounds (without on-card holdup capacitor)
IPMI Controller (Optional)
- VITA 46.11 Tier 1 and Tier 2 IPMI Controller (IPMC)
- Monitors voltages
- Monitors temperature sensors
- Connects to backplane via system management bus (I²C)
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
