Entech Electronics Inc. Entech Electronics Inc.

Description
Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities: Component Procurement & Management Service · Domestic and International supply lines. · Procurement teams in Shenzhen and Australia. · Customs arrangements and documentation for importation of client supplied components (FIA) available. · Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables. · Metal fabrication, casting and extrusion, including all finishes and pad printing. · Plastics tooling and manufacture. Assembly facilities · Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement. · Lead free processing. · Through Hole Assembly Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full functional testing using dedicated Jigs and fixtures. · Functional testing (Teradyne A360, Geotester). · X-Ray and Optical inspection facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including manuals, CDs, literature and cartons. · Shipping direct to the end user. Other services · Design advice on suitability for manufacture (DFM). · Engineering support including PCB layouts and design. · Production tooling and test jig design and manufacture.
Description
Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities: Component Procurement & Management Service · Domestic and International supply lines. · Procurement teams in Shenzhen and Australia. · Customs arrangements and documentation for importation of client supplied components (FIA) available. · Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables. · Metal fabrication, casting and extrusion, including all finishes and pad printing. · Plastics tooling and manufacture. Assembly facilities · Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement. · Lead free processing. · Through Hole Assembly Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full functional testing using dedicated Jigs and fixtures. · Functional testing (Teradyne A360, Geotester). · X-Ray and Optical inspection facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including manuals, CDs, literature and cartons. · Shipping direct to the end user. Other services · Design advice on suitability for manufacture (DFM). · Engineering support including PCB layouts and design. · Production tooling and test jig design and manufacture.

Suppliers

Company
Product
Description
Supplier Links
 - Entech Electronics Inc. - Entech Electronics Inc.
Santa Clara, CA, USA
Entech Electronics Inc.
Entech Electronics Inc.
Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities: Component Procurement & Management Service · Domestic and International supply lines. · Procurement teams in Shenzhen and Australia. · Customs arrangements and documentation for importation of client supplied components (FIA) available. · Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables. · Metal fabrication, casting and extrusion, including all finishes and pad printing. · Plastics tooling and manufacture. Assembly facilities · Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement. · Lead free processing. · Through Hole Assembly Lines. · Dual Wave, Wave Soldering machine. · Fine Pitch QFP to .02" (0.5mm). · BGA to .01" (0.3mm). · Chip components 0201. · PCB size 1.18"-20" (30-510mm). · Mixed technology assembly. · Mechanical and box build assembly. Testing · MDA (Bed of Nails using HP3065 & HP3070). · Full functional testing using dedicated Jigs and fixtures. · Functional testing (Teradyne A360, Geotester). · X-Ray and Optical inspection facility for BGA placement. · PC based test systems (Dedicated, JTAG/Boundary Scan). Turnkey product manufacturing · Total product build. · Packaging and warehousing including manuals, CDs, literature and cartons. · Shipping direct to the end user. Other services · Design advice on suitability for manufacture (DFM). · Engineering support including PCB layouts and design. · Production tooling and test jig design and manufacture.

Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities:

Component Procurement & Management Service

· Domestic and International supply lines.

· Procurement teams in Shenzhen and Australia.

· Customs arrangements and documentation for importation of client supplied components (FIA) available.

· Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.

· Metal fabrication, casting and extrusion, including all finishes and pad printing.

· Plastics tooling and manufacture.

Assembly facilities

· Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement.

· Lead free processing.

· Through Hole Assembly Lines.

· Dual Wave, Wave Soldering machine.

· Fine Pitch QFP to .02" (0.5mm).

· BGA to .01" (0.3mm).

· Chip components 0201.

· PCB size 1.18"-20" (30-510mm).

· Mixed technology assembly.

· Mechanical and box build assembly.

Testing

· MDA (Bed of Nails using HP3065 & HP3070).

· Full functional testing using dedicated Jigs and fixtures.

· Functional testing (Teradyne A360, Geotester).

· X-Ray and Optical inspection facility for BGA placement.

· PC based test systems (Dedicated, JTAG/Boundary Scan).

Turnkey product manufacturing

· Total product build.

· Packaging and warehousing including manuals, CDs, literature and cartons.

· Shipping direct to the end user.

Other services

· Design advice on suitability for manufacture (DFM).

· Engineering support including PCB layouts and design.

· Production tooling and test jig design and manufacture.

Technical Specifications

  Entech Electronics Inc.
Product Category Contract Manufacturing Services
Product Number Entech Electronics Inc.
Company Information Entech Electronics, with its direct overseas staff, has established links with world's best practice suppliers, and developed unprecedented capabilities to provide high quality, low cost manufacturing services to electronics industry.
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