RS Components, Ltd. 567581

A heat curable, one part thixotropic paste adhesive for holding components in place during soldering operations on surface mount assemblies. High ‘green strength’, or stickiness, ensures components do not move during handling, before curing has taken place. Thixotropic properties give high dot profile. Unaffected by UV light - assembly can be carried out in daylight. Solvent resistant. Excellent electrical characteristics. Long term stability after cure cycle. Single part system for quick and easy use. Flexible in cured state to ensure components are not stressed. Medium strength cured bond allows removal of components for reworking. Colour Red. Consistency Thixotropic paste . Dielectric constant 3.5 @ 1kHz. Filler diameter <10 microns. Hardness (shore) 85. Suitable dispensing needles stock nos. 690-811 Package Type = Syringe Package Size = 10 ml Cure Time = 20 (120°C) min, 40 (100°C) min, 60 (90°C) min Number of Parts = 1 Colour = Red Maximum Operating Temperature = +140°C Viscosity Measurement = 1450mPa/s Special Features = Solvent Resistant Chemical Composition = Aliphatic Amines, Epoxy Resin, Neopentyl Glycol Diglycidyl Ether Specific Gravity = 1.16