SRBP-paper FR2 1.5mm, solder-lacquered. EPOXY fibre-glass FR4 1.5 mm, hot air levelled (HAL-leadfree). Board size 100 x 160 x 1.6mm. Hole layout 37 x 57. Hole dia 1.0mm. Pitch 2.54mm (0.1in). Copper thickness 35µm
Base Material = Synthetic Resin Bonded Paper
Number of Sides = 1
Dimensions = 100 x 160 x 1.5mm
Copper Thickness = 35µm
Hole Diameter = 1mm
Hole Layout = 37 x 57
Hole Pitch = 2.54 x 2.54mm
Connection = DIN 41612
FR Material Grade = FR2
Length = 100mm
| RS Components, Ltd. | |
|---|---|
| Product Category | Electronic Development Boards |
| Product Number | 2065879 |
| Development Tool | Break Out Board |
