RS Components, Ltd. 2065841

SRBP type: SRBP-paper FR2 1.5mm, solder-lacquered. EPOXY type: EPOXY fibre-glass FR4 1.5mm. Board size 100 x 160 x 1.6mm. Hole layout 38 x 61. Hole dia 1.0mm. Pitch 2.54mm (0.1in). Copper thickness 35µm Base Material = Synthetic Resin Bonded Paper Number of Sides = 1 Dimensions = 100 x 160 x 1.5mm Copper Thickness = 35µm Hole Diameter = 1mm Hole Layout = 38 x 61 Hole Pitch = 2.54 x 2.54mm FR Material Grade = FR2 Length = 100mm Thickness = 1.5mm