ECS Inc. International Through Hole Crystals ECS-40.3-20-4X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-40.3-20-4X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-40.3-20-4X
Through Hole Crystals ECS-40.3-20-4X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet
Crystals - X1087-ND - DigiKey
Thief River Falls, MN, United States
Crystals
X1087-ND
Crystals X1087-ND
4.032MHz ±30ppm Crystal 20pF 150 Ohms HC-49/US

4.032MHz ±30ppm Crystal 20pF 150 Ohms HC-49/US

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Crystals, Oscillators, Resonators Crystals -  - Win Source Electronics
Laguna Hills, CA, United States
Crystals, Oscillators, Resonators Crystals
Crystals, Oscillators, Resonators Crystals
Alternative Parts (Cross-Reference): Cross Manufacturer: ECS Inc. Category: Crystals, Oscillators, Resonators Crystals Series: HC-49USX Package: Bulk Product Status: Active Type: MHz Crystal Frequency: 4.032 MHz Frequency Stability: ±50ppm Frequency Tolerance: ±30ppm Load Capacitance: 20pF

Alternative Parts (Cross-Reference): Cross
Manufacturer: ECS Inc.
Category: Crystals, Oscillators, Resonators Crystals
Series: HC-49USX
Package: Bulk
Product Status: Active
Type: MHz Crystal
Frequency: 4.032 MHz
Frequency Stability: ±50ppm
Frequency Tolerance: ±30ppm
Load Capacitance: 20pF

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CRYSTAL 4.0320MHZ 20PF TH

CRYSTAL 4.0320MHZ 20PF TH

Supplier's Site

Technical Specifications

  ECS Inc. International DigiKey Win Source Electronics Acme Chip Technology Co., Limited
Product Category Crystals Crystals Oscillators Crystals
Product Number ECS-40.3-20-4X X1087-ND ECS-40.3-20-4X
Product Name Through Hole Crystals Crystals Crystals, Oscillators, Resonators Crystals Crystals
Package / Form Factor Through Hole Crystals Through Hole; HC-49/US Through Hole
Features / Standards RoHS Lead-Free
Frequency 4.03 MHz 4.03 MHz 4.03 MHz
Frequency Stability 50 ppm 50 ppm 50 ppm
Load Capacitance 20 pF 20 pF 20 pF
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