ECS Inc. International Through Hole Crystals ECS-120-32-4X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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The HC-49USX is a low-profile, thru-hole quartz crystal designed for stable frequency reference in electronic circuits. It has a maximum height of 3.5 mm and is soldered with a peak temperature of 260°C for up to 10 seconds over two cycles. The part operates from -10°C to +70°C with a frequency stability of ±50 ppm over that range and a frequency tolerance of ±30 ppm at +25°C. It supports frequencies from 3.570 MHz to 70.000 MHz, with equivalent series resistance ranging from 30 Ω to 200 Ω depending on frequency and mode, using fundamental or 3rd overtone operation. Load capacitance is specified in the part number and defaults to 10 pF or 20 pF. The device is RoHS compliant, has a shunt capacitance of 7 pF, and a maximum drive level of 500 μW. Aging is ±5 ppm over the first year at +25°C.

Datasheet Summary
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The HC-49USX is a low-profile, thru-hole quartz crystal designed for stable frequency reference in electronic circuits. It has a maximum height of 3.5 mm and is soldered with a peak temperature of 260°C for up to 10 seconds over two cycles. The part operates from -10°C to +70°C with a frequency stability of ±50 ppm over that range and a frequency tolerance of ±30 ppm at +25°C. It supports frequencies from 3.570 MHz to 70.000 MHz, with equivalent series resistance ranging from 30 Ω to 200 Ω depending on frequency and mode, using fundamental or 3rd overtone operation. Load capacitance is specified in the part number and defaults to 10 pF or 20 pF. The device is RoHS compliant, has a shunt capacitance of 7 pF, and a maximum drive level of 500 μW. Aging is ±5 ppm over the first year at +25°C.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-120-32-4X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-120-32-4X
Through Hole Crystals ECS-120-32-4X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet
Crystals - X1100-ND - DigiKey
Thief River Falls, MN, United States
Crystals
X1100-ND
Crystals X1100-ND
12MHz ±30ppm Crystal 32pF 60 Ohms HC-49/US

12MHz ±30ppm Crystal 32pF 60 Ohms HC-49/US

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Oscillators - ECS-120-32-4X - 917792-ECS-120-32-4X - Win Source Electronics
Laguna Hills, CA, United States
Oscillators - ECS-120-32-4X
917792-ECS-120-32-4X
Oscillators - ECS-120-32-4X 917792-ECS-120-32-4X
Manufacturer: ECS Inc. Win Source Part Number: 917792-ECS-120-32-4X Series: HC-49USX Operating Temperature Range: -10°C ~ 70°C Features: ±30ppm Crystal 32pF HC-49/US Package: HC-49/US Package: Bulk Mounting: Through Hole Categories: Crystals ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 95 pct. Supply and Demand Status: Balance Quantity per package: 200 MSL Level: 1 (Unlimited) Estimated Pruduction Lead Time: 21 Weeks HTSUS: 8541.60.0050 Other Part Number: ECS120324X, X1100

Manufacturer: ECS Inc.
Win Source Part Number: 917792-ECS-120-32-4X
Series: HC-49USX
Operating Temperature Range: -10°C ~ 70°C
Features: ±30ppm Crystal 32pF HC-49/US
Package: HC-49/US
Package: Bulk
Mounting: Through Hole
Categories: Crystals
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 95 pct.
Supply and Demand Status: Balance
Quantity per package: 200
MSL Level: 1 (Unlimited)
Estimated Pruduction Lead Time: 21 Weeks
HTSUS: 8541.60.0050
Other Part Number: ECS120324X, X1100

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Technical Specifications

  ECS Inc. International DigiKey Win Source Electronics
Product Category Crystals Crystals Oscillators
Product Number ECS-120-32-4X X1100-ND 917792-ECS-120-32-4X
Product Name Through Hole Crystals Crystals Oscillators - ECS-120-32-4X
Package / Form Factor Through Hole Crystals Through Hole; HC-49/US
Features / Standards RoHS Lead-Free
Frequency 12 MHz
Frequency Stability 50 ppm 50 ppm
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