DuPont Electronics & Imaging High Modulus Polyimide Film Kapton® EN

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications include: Flexible printed circuits Fine pitch circuitry Chip scale packaging High density interconnects