DuPont Electronics & Imaging High Modulus Polyimide Film Kapton® EN

Description
DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications include: Flexible printed circuits Fine pitch circuitry Chip scale packaging High density interconnects
Datasheet
Description
DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications include: Flexible printed circuits Fine pitch circuitry Chip scale packaging High density interconnects
Datasheet

Suppliers

Company
Product
Description
Supplier Links
High Modulus Polyimide Film - Kapton® EN - DuPont Electronics & Imaging
Research Triangle Park, NC, United States
High Modulus Polyimide Film
Kapton® EN
High Modulus Polyimide Film Kapton® EN
DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper. Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer. The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable. Applications include: Flexible printed circuits Fine pitch circuitry Chip scale packaging High density interconnects

DuPont™ Kapton® EN is a premium performance polyimide film for use as a dielectric substrate for flexible printed circuits and high density interconnects. Kapton® EN is the preferred dielectric film for very fine pitch circuitry due to its superior dimensional stability, lay-flat, high modulus, and a coefficient of thermal expansion match to copper.

Kapton® EN is offered in a wide range of thickness from 5 µm ultra-thin to 50 µm thick, which provides more design flexibility to the customer.

The excellent electrical characteristics and chemical etchability inherent to Kapton® HN and VN films have been maintained in Kapton® EN polyimide film. Kapton® EN film also has very low moisture absorption and is laser ablatable.

Applications include:

  • Flexible printed circuits
  • Fine pitch circuitry
  • Chip scale packaging
  • High density interconnects
Supplier's Site Datasheet

Technical Specifications

  DuPont Electronics & Imaging
Product Category Thin Film Materials
Product Number Kapton® EN
Product Name High Modulus Polyimide Film
Material Polyimide
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