CSP Technologies, Inc. Activ-Blister™ Solutions

Description
CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines. Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size. CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.
  • Activ-Blister™ Solutions - CSP Technologies, Inc.
    CSP Technologies, Inc.
Datasheet
Description
CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines. Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size. CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Activ-Blister™ Solutions - - CSP Technologies, Inc.
CSP Technologies, Inc.
Auburn, AL, USA
Activ-Blister™ Solutions
Activ-Blister™ Solutions
CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines. Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size. CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.

CSP Activ-BlisterTM solutions protect moisture- and oxygen-sensitive solid doses packaged on blister machines.

Using silica gel and molecular sieve technology, outfitted blisters can absorb tailored amounts of water vapor, oxygen, or a combination of the two, and can be produced in shapes and sizes to accommodate any tablet and capsule size.

CSP Technologies developed Activ-BlisterTM solutions to control the internal atmosphere of existing individual blister cavities, allowing for improved product performance and enhanced shelf-life. The innovative technology can be applied via heat-staking without the use of adhesives and without changes to the existing footprint of a packaging line.

Supplier's Site Datasheet

Technical Specifications

  CSP Technologies, Inc.
Product Category Protective Packaging
Product Name Activ-Blister™ Solutions
Protective Packaging / Dunnage Blister Packaging
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