Boyd Insulating Cover; Insulator Body Material Boyd 8909NBG

Description
INSULATING COVER; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Material:Nylon RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulating Cover; Insulator Body Material Boyd - 18M8294 - Newark, An Avnet Company
Chicago, IL, United States
Insulating Cover; Insulator Body Material Boyd
18M8294
Insulating Cover; Insulator Body Material Boyd 18M8294
INSULATING COVER; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Material:Nylon RoHS Compliant: Yes

INSULATING COVER; Insulator Body Material:Nylon (Polyamide); Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Material:Nylon RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18M8294
Product Name Insulating Cover; Insulator Body Material Boyd
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Conductive Rubber Cap - HC-93 - Shiu Li Technology Co., Ltd
Shiu Li Technology Co., Ltd
Specs
Type High Dielectric
Form / Shape Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
Chemical System Silicone
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 374552 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Form / Shape 300 ml cartridge (10:2 ratio)
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
One component not drooping thermal cooling gel for CPU - SE20 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thin Film, Low Hardness - SARCON ® QR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details