Boyd Thermal Interface Material, 47.5G; Dispensing Method Boyd 100300F00000G

Description
THERMAL INTERFACE MATERIAL, 47.5G; Dispensing Method:Hand Held Applicator; Volume:-; Weight:47.5g; Product Range:Ultrastick Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Material, 47.5G; Dispensing Method Boyd - 55M7570 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Material, 47.5G; Dispensing Method Boyd
55M7570
Thermal Interface Material, 47.5G; Dispensing Method Boyd 55M7570
THERMAL INTERFACE MATERIAL, 47.5G; Dispensing Method:Hand Held Applicator; Volume:-; Weight:47.5g; Product Range:Ultrastick Series RoHS Compliant: Yes

THERMAL INTERFACE MATERIAL, 47.5G; Dispensing Method:Hand Held Applicator; Volume:-; Weight:47.5g; Product Range:Ultrastick Series RoHS Compliant: Yes

Supplier's Site Datasheet
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar - 70115240 - Allied Electronics, Inc.
Fort Worth, TX, USA
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar
70115240
Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar 70115240
Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. Ultrastick comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, opaque white film-like deposit, providing excellent heat transfer and low interface thermal resistance.

Aavid's Ultrastick is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffin-based thermal compound changes phase at 60°C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. Ultrastick comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, opaque white film-like deposit, providing excellent heat transfer and low interface thermal resistance.

Supplier's Site

Technical Specifications

  Newark, An Avnet Company Allied Electronics, Inc.
Product Category Thermal Compounds and Thermal Interface Materials Thermal Compounds and Thermal Interface Materials
Product Number 55M7570 70115240
Product Name Thermal Interface Material, 47.5G; Dispensing Method Boyd Ultrastick Phase Change Thermal Interface Compound 47.5 gram bar
Form / Shape Grease, Paste
Unlock Full Specs
to access all available technical data

Similar Products

Exceptionally Soft Thermal Conductive Gel Pad - BS89 - Shiu Li Technology Co., Ltd
Specs
Form / Shape Pad; Sheet Form, Die-cut Parts
Chemical System Silicone
Gap Fill 0.0197 to 0.1969 inch (0.5000 to 5 mm)
View Details
Formulations - Applications - Thermally Conductive - 3319A55 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Two Component  
Form / Shape 5 gal - part A
Chemical System Epoxy
View Details
Thermal gel with excellent extrusion performance - SE60 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Non-silicone, Polysynthetic-based Thermal Grease - SARCON ® SG 26NS - Fujipoly® America Corp.
Specs
Form / Shape Grease, Paste
Industry Electronics; Semiconductors, IC's
Use Temperature -40 to 392 F (-40 to 200 C)
View Details