Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H61 single chip architecture
Support 2-DIMM DDR3-1600/1333/1066 up to 16G maximum capacity
100% X.D.C solid capacitor
Biostar Microtech (U.S.A) Corp.
Done
Description
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H61 single chip architecture
Support 2-DIMM DDR3-1600/1333/1066 up to 16G maximum capacity
100% X.D.C solid capacitor
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H61 single chip architecture
Support 2-DIMM DDR3-1600/1333/1066 up to 16G maximum capacity
100% X.D.C solid capacitor
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H61 single chip architecture
Support 2-DIMM DDR3-1600/1333/1066 up to 16G maximum capacity
