MacDermid Alpha Electronics Solutions Integrated Circuit Substrate Systek UVF 100

The build up of redistribution layers in IC substrate manufacturing requires the metallization of various features within very tight specifications from a single solution. These include filled blind microvias, filled laser drilled X-vias, and fine lines and pads. The Systek UVF 100 is specifically designed for the 2-in-1 RDL plating of IC substrate features. The precise chemical system fills blind microvias and X-vias with minimal dimples or overfill, eliminating the concern of dielectric thinning while providing an excellent base for further stacking. At the same time, the process also plates lines, pads, and other surface features with high coplanarity and low trace profiles resulting in an optimal final copper surface for the layer. The Systek UVF 100 is a production-proven 2 in 1 pattern plating copper metallization that enables panel-level packaging IC substrate designs.