MacDermid Alpha Electronics Solutions STAYSTIK ® 793

Alumina Filled Dielectric Paste Product Overview STAYSTIK 793 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heatsink or substrate bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Fast bonding to a variety of substrates Easily reworkable material