MacDermid Alpha Electronics Solutions STAYSTIK ® 682

Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 682 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding. This film can be used for die attach and/or substrate attach in hybrid or multi-chip modulus (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates