MacDermid Alpha Electronics Solutions STAYSTIK ® 672

Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 672 thermoplastic adhesive film is designed for use in a variety of electronic applications. STAYSTIK 672 is characterized by excellent bonding at low process temperatures and extremely low elastic modulus (60,000psi). The compliancy of this film adhesive allows for the bonding of two materials with large dissimilarities in thermal expansion coefficients (TCEs). STAYSTIK 672 is excellent for daughter card to board or heat sink attach. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Fast bonding to a variety of substrates Easily reworkable material