MacDermid Alpha Electronics Solutions STAYSTIK ® 611

Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 611 thermoplastic adhesive film is ideal for applications where resistance to high temperature excursions is desired. This adhesive film can be used for die attach in solder sealed, hermetic packages and demonstrates low RGA moisture readings. This high temperature, reworkable thermoplastic system offers many unique advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates