MacDermid Alpha Electronics Solutions STAYSTIK ® 393

Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 393 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heatsink bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Fast bonding to a variety of substrates Easily reworkable material