MacDermid Alpha Electronics Solutions STAYSTIK ® 383

Non-filled Dielectric Interposer Paste Product Overview STAYSTIK 383 thermoplastic adhesive paste is designed for use in a variety of electronic applications, and is characterized by excellent bonding properties. STAYSTIK 383 is suitable for die and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates