MacDermid Alpha Electronics Solutions STAYSTIK ® 181AK

Thermoplastic Adhesive Paste STAYSTIK 181AK is characterized by its excellent bonding properties. The paste can be used for die, lid seal and/or substrate attach in hybrid, multi-chip modules (MCMs) or other microelectronic packages. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Meets MIL STD 883 requirements Extremely low outgassing Fast bonding to a variety of substrates