Niche specialty processes for high reliability bonding, copper adhesion, etching, and high speed signal integrity.
Product Overview
MacDermid Alpha understands the challenges of providing conductor shapes that exceed your customers’-controlle
d impedance requirements, while reliably bonding to next-generation dielectrics for lead-free, low-loss applications. As new materials continue to evolve in this space, MacDermid Alpha will deliver processes for the wide range of specialty applications in IC substrate manufacturing. As the demonstrated market leader in the development of high reliability bonding conversion coatings and precision etches for all substrate applications, let MacDermid Alpha provide you with the solution you need.
Product Features
Anisotropic final etch with minimal undercut and square circuit profile
Copper adhesion promotion for high speed applications
Laser direct drilling oxide coating for improved consistency of drilling process
Niche specialty processes for high reliability bonding, copper adhesion, etching, and high speed signal integrity.
Product Overview
MacDermid Alpha understands the challenges of providing conductor shapes that exceed your customers’-controlled impedance requirements, while reliably bonding to next-generation dielectrics for lead-free, low-loss applications. As new materials continue to evolve in this space, MacDermid Alpha will deliver processes for the wide range of specialty applications in IC substrate manufacturing. As the demonstrated market leader in the development of high reliability bonding conversion coatings and precision etches for all substrate applications, let MacDermid Alpha provide you with the solution you need.
Product Features
- Anisotropic final etch with minimal undercut and square circuit profile
- Copper adhesion promotion for high speed applications
- Laser direct drilling oxide coating for improved consistency of drilling process
