MacDermid Alpha Electronics Solutions FOWLP Solder Surfaces NOVAFAB ® Pd Acid Strike

Product Overview NOVAFAB® Pd Acid Strike is a high-performance palladium acid pre-plate specifically designed for Fan-Out Wafer Level Packaging (FOWLP) solder surface applications. It delivers thin, uniform palladium deposits across a wide range of current densities and electroplating conditions, ensuring excellent adhesion and compatibility with subsequent metallization processes. Ideal as either a stand-alone palladium film or a pre-plate layer before further electroplating, NOVAFAB Pd Acid Strike offers precise process control, consistent deposition, and simplified maintenance—optimizi ng reliability and performance in advanced fan-out wafer-level packaging solder surface fabrication.