MID plating solutions specifically optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices.
Product Overview
MacDermid Enthone's molded interconnect devices (MID) plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. Delivering consistent selectivity on a wide variety of materials and catalysts, our copper, nickel, gold, and silver plating solutions enable more complex and efficient designs on the most desirable and low cost molding composites. Simple and controllable processes result in steady plating rates coupled with long and predictable bath performance.
MID applications are rapidly expanding into new and exciting areas in electronics applications. Once a mainstay in mobile devices, increasing opportunities are now spreading within the medical, automotive, and lighting industries. As these opportunities expand, new materials have been considered to address physical properties and costs related to the application.
Product Features
Unmatched selectivity on laser direct structured materials
Highest yields on all current and emerging plastics
Stable, long-lasting, easy-to-use chemical processes
High tech applications in fine pitch plating and wire bonding
MID plating solutions specifically optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices.
Product Overview
MacDermid Enthone's molded interconnect devices (MID) plating solutions are specifically designed and optimized to deliver precise selectivity, high yields, and ease-of-use for laser direct structured, catalytic ink, and double-shot molded interconnect devices. Delivering consistent selectivity on a wide variety of materials and catalysts, our copper, nickel, gold, and silver plating solutions enable more complex and efficient designs on the most desirable and low cost molding composites. Simple and controllable processes result in steady plating rates coupled with long and predictable bath performance.
MID applications are rapidly expanding into new and exciting areas in electronics applications. Once a mainstay in mobile devices, increasing opportunities are now spreading within the medical, automotive, and lighting industries. As these opportunities expand, new materials have been considered to address physical properties and costs related to the application.
Product Features
- Unmatched selectivity on laser direct structured materials
- Highest yields on all current and emerging plastics
- Stable, long-lasting, easy-to-use chemical processes
- High tech applications in fine pitch plating and wire bonding
