MacDermid Alpha Electronics Solutions MICROFAB ® SPM-1100

MICROFAB SPM-1100 copper plating solution demonstrates superior high-speed plating and coplanarity in a KV low system which provides exceptional within-wafer, within-die, and within-feature uniformity. Product Overview The MICROFAB SPM-1100 process is engineered for high-speed pillar, copper stud and Under-Bump Metallization (UBM) applications. It provides exceptional within-wafer, within-die, and within-feature uniformity. Features Pillar / Post Excellent coplanarity High speed High throughput Flat bump shape Low voiding