MacDermid Alpha Electronics Solutions MICROFAB ® SN-350

MICROFAB SN-350 is a high-speed, low alpha pure tin plating process that produces compact grain structures and smooth surface morphology, which is used for flip chip bumping and microbump applications. Product Overview MICROFAB SN-350 Tin bump plating bath is an organic sulfonate-based electrolyte, for high speed electro-deposition of smooth fine-grained, uniform Tin bumps. The chemistry is robust enough for both bumping and capping a wide range of patterned wafers. It exhibits good post-reflow with-in die (WID) bump thickness uniformity over a wide range of wafer types, which demonstrates its suitability for high-volume manufacturing. Features Pure tin Low alpha Smooth deposit Excellent coplanarity Low surface roughness High speed