MacDermid Alpha Electronics Solutions MICROFAB ® RDLV Series

The MICROFAB RDLV Series offers three solutions to have best-in-class performance for the simultaneous plating of RDL lines and filling of vias across a wide range of line, space and via dimensions. MICROFAB RDLV 50, 60, 70 The MICROFAB RDLV 50, 60, 70 processes are an acid copper plating system designed for simultaneous plating of RDL lines and filling of vias across a wide range of line, space and via dimensions. These products have been designed to attain bottom-up via filling while maintaining a flat line profile with excellent uniformity. Features 2 in 1 RDL Excellent bottom up fill Excellent coplanarity Versatility Low voiding Flat bump shape Low-line doming