MacDermid Alpha Electronics Solutions MICROFAB ® EVF NiBAR

Wafer Level Packaging (WLP) continues to demand high yield, high performance packages, MacDermid Alpha is growing it’s WLP portfolio of innovation driven by green initiatives while building on industry leading barrier technology. Product Overview MICROFAB EVF NiBAR is a sulfamate nickel via fill and / or barrier electroplating process that produces a pure, ductile, fine-grained, low stress nickel deposit required to meet the needs of the semiconductor industry for quality assured chemistry. MICROFAB EVF NiBAR is manufactured to meet the exacting performance and manufacturing requirements associated with wafer plating and contains no boric acid in compliance with specific regulatory needs. Features High speed deposition Bright/smooth Small grain size Stress tunable Low temperature