MacDermid Alpha Electronics Solutions MICROFAB ® AU3151B

MICROFAB Au3151B creates 'high hardness' gold bumping with a hardness adjuster. This process is not possible with a conventional gold process. MICROFAB Au3151B is best suited for semiconductor wafers for Au bump plating process or processes that require less grain growth during heat treatment. Product Overview MICROFAB Au3151B is a mild alkaline non-cyanide high purity hardness gold electroplating process that has proven reliability and bondability. MICROFAB Au3151B performs as high hardness gold bumping by adopting the organic hardness adjuster, which cannot be achieved with conventional gold processes. Features High speed deposition High hardness Uniform post gold seed etch