MacDermid Alpha Electronics Solutions MICROFAB ® AU100 DEPLATE

Gold plating solutions have evolved dramatically over the years to achieve fine line, step coverage and bump plating. To further reduce operating costs MacDermid Alpha has developed a non-cyanide deplate to accompany our best in class gold solutions. Product Overview MICROFAB AU100 DEPLATE is part of our gold plating program and is designed to reduce cost by selectively stripping gold seed metallization. This solution is specially formulated for gold seeds with Ti barrier metal (TA, Ti). Features Deplate only – Ti compatible Uniform post gold seed etch Lead-free Arsenic-free Cyanide-free Thallium-free