From specialty applications to technology-enabling solutions allowing for thinner, faster devices, we have everything you need to bridge the performance gap to your next-generation product.
Product Overview
Our integrated leadframe product portfolio incorporates connected solutions, which span the entire process of building QFN packages from leadframe roughening to enhancing sidewall solderability, and nearly everything in between. Leadframe packages are evolving into a state-of-the-art technology due to their robust reliability and great improvement on performance. With automotive electronics expanding at a rapid rate, leadframe packages like QFNs, QFSs, and DIPs will soon be deployed in new environments that demand the highest reliability. We offer a range of innovative products that enhance reliability of these metal substrate packages.
Product Features
Decades of industry expertise
Technology enabling solutions for thinner, faster devices
Specialty application and technology enabling solutions
From specialty applications to technology-enabling solutions allowing for thinner, faster devices, we have everything you need to bridge the performance gap to your next-generation product.
Product Overview
Our integrated leadframe product portfolio incorporates connected solutions, which span the entire process of building QFN packages from leadframe roughening to enhancing sidewall solderability, and nearly everything in between. Leadframe packages are evolving into a state-of-the-art technology due to their robust reliability and great improvement on performance. With automotive electronics expanding at a rapid rate, leadframe packages like QFNs, QFSs, and DIPs will soon be deployed in new environments that demand the highest reliability. We offer a range of innovative products that enhance reliability of these metal substrate packages.
Product Features
- Decades of industry expertise
- Technology enabling solutions for thinner, faster devices
- Specialty application and technology enabling solutions
