MacDermid Alpha Electronics Solutions KESTER TSF-ULR18

No clean paste flux with low residue post reflow and low voiding performance. Product Overview Kester TSF-ULR18 is a no clean ultra low residue tacky flux. TSF-ULR18 is highly recommended for Flip Chip on leadframe (FCOL, FCQFN, etc) packages, where flux cleaning is not required. TSF-ULR18 produces post reflow residue of below 10% wt, that is highly reliable and is compatible with post process materials. Features Ultra low residue post reflow; <10% by Wt Excellent for Flip Chip on leadframe package Halide and halogen-free formulation