No clean paste flux with high activity and clear residues.
Product Overview
Kester TSF-6592HF is a no clean paste flux designed as a lead-free solution for an array of lead free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It is optimized for consistent high speed printing applications.
Features
Bright shiny solder joints with clear residues
Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
Clear non-tacky residues
High tack to minimize skewing of components
No clean paste flux with high activity and clear residues.
Product Overview
Kester TSF-6592HF is a no clean paste flux designed as a lead-free solution for an array of lead free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It is optimized for consistent high speed printing applications.
Features
- Bright shiny solder joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
- Clear non-tacky residues
- High tack to minimize skewing of components
