MacDermid Alpha Electronics Solutions KESTER SE-CURE 9665

No clean low residue liquid flux for indium solder preform thermal interface lid attach. Product Overview Kester SE-CURE 9665 is no clean liquid flux formulated with a heat stabilized system for solder perform application. It is specially designed for indium solder TIM soldering. Its low solid content and robust head stabilized system enable low voiding performance even after 3 to 5 reflow cycles. After reflow SE-CURE 9665 residues can be left on board and do not require cleaning. SE-CURE 9665 is designed for a wide range of temperature and humidity conditions. Features Excellent soldering especially for indium solder preforms Very low voiding even after multiple reflows for indium TIM application