Kester 951 is a halogen-free, rosin-free, no-clean, alcohol-based liquid flux, specifically developed to deliver outstanding board cosmetics and to eliminate solder balling and solder bridging.
Product Overview
Kester 951 is a halogen-free, rosin-free, low solid, low residue no-clean flux. The extremely low-solids (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing.
Kester 951 exhibits improved soldering performance to minimize solder bridges and excessive solder defects. The surface insulation resistance on soldered boards by Kester 951 is higher than that provided by typical water soluble fluxes. It contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
Product Features
Halogen free
Thermally stable activators for good hole-fill, low solder bridging and low solder balling
Very low level of non-tacky residue to improve pin testability and eliminate post-soldering cleaning
SIR IPC J-STD-004 compliant for long term electrical reliability
ORL0 per IPC J-STD-004
Kester 951 is a halogen-free, rosin-free, no-clean, alcohol-based liquid flux, specifically developed to deliver outstanding board cosmetics and to eliminate solder balling and solder bridging.
Product Overview
Kester 951 is a halogen-free, rosin-free, low solid, low residue no-clean flux. The extremely low-solids (2.0%) and nature of the activator system results in practically no residue left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine. There are no residues to interfere with electrical testing.
Kester 951 exhibits improved soldering performance to minimize solder bridges and excessive solder defects. The surface insulation resistance on soldered boards by Kester 951 is higher than that provided by typical water soluble fluxes. It contains a corrosion inhibitor such that no corrosion products are formed when bare copper surfaces are exposed to humid environments.
Product Features
- Halogen free
- Thermally stable activators for good hole-fill, low solder bridging and low solder balling
- Very low level of non-tacky residue to improve pin testability and eliminate post-soldering cleaning
- SIR IPC J-STD-004 compliant for long term electrical reliability
- ORL0 per IPC J-STD-004
