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MacDermid Alpha Electronics Solutions Electrolytic Copper Through Hole Filling

Description
The Systek™ THF Series high performance copper plating technology that bridges and fills through holes. Product Overview Manufacturers of advanced printed circuit boards struggle to overcome the challenge of core layer and other through hole filling for thermal and structural applications. Fabricators can achieve improved thermal conductivity over paste filling, skip resource intensive planarization steps, and achieve excellent reliability with the solid copper filling provided by the Systek THF Series, allowing for greater design freedom. Product Features Unparalleled cavity free filling of through holes vs DC copper Flat filling for subsequent stack build ups Minimization of surface copper for HDI applications Improved thermal conductivity Drastically reduced plating times Elimination of planarization processes
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Suppliers

Company
Product
Description
Supplier Links
Electrolytic Copper Through Hole Filling -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Electrolytic Copper Through Hole Filling
Electrolytic Copper Through Hole Filling
The Systek™ THF Series high performance copper plating technology that bridges and fills through holes. Product Overview Manufacturers of advanced printed circuit boards struggle to overcome the challenge of core layer and other through hole filling for thermal and structural applications. Fabricators can achieve improved thermal conductivity over paste filling, skip resource intensive planarization steps, and achieve excellent reliability with the solid copper filling provided by the Systek THF Series, allowing for greater design freedom. Product Features Unparalleled cavity free filling of through holes vs DC copper Flat filling for subsequent stack build ups Minimization of surface copper for HDI applications Improved thermal conductivity Drastically reduced plating times Elimination of planarization processes

The Systek™ THF Series high performance copper plating technology that bridges and fills through holes.

Product Overview

Manufacturers of advanced printed circuit boards struggle to overcome the challenge of core layer and other through hole filling for thermal and structural applications. Fabricators can achieve improved thermal conductivity over paste filling, skip resource intensive planarization steps, and achieve excellent reliability with the solid copper filling provided by the Systek THF Series, allowing for greater design freedom.


Product Features

  • Unparalleled cavity free filling of through holes vs DC copper
  • Flat filling for subsequent stack build ups
  • Minimization of surface copper for HDI applications
  • Improved thermal conductivity
  • Drastically reduced plating times
  • Elimination of planarization processes
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Electrical and Electronic Resins
Product Name Electrolytic Copper Through Hole Filling
Industry Semiconductors, IC's
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