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MacDermid Alpha Electronics Solutions Copper Adhesion Promotion

Description
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates. Product Overview Adhesion between the innerlayer copper circuits and the resin is critical for long term reliability of the printed circuit or IC substrate. The MacDermid Enthone brand has a portfolio of different copper surface treatments to meet the needs of any application. To compliment the expanding use of low-profile copper foils for high frequency applications, we also provide surface treatment options that are designed specifically for high speed/low-loss applications. MacDermid Enthone’s products are specifically engineered to provide robust reliability across a wide range of resin systems and copper foil types, and can meet the system requirements for any application type. Product Features High reliability innerlayer bonding on a wide variety of materials Prepares copper surfaces for optimum efficiency Compatible with a full range of resins Complete offering of surface treatment systems Signal integrity/low loss for high speed applications
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Suppliers

Company
Product
Description
Supplier Links
Copper Adhesion Promotion -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Copper Adhesion Promotion
Copper Adhesion Promotion
A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates. Product Overview Adhesion between the innerlayer copper circuits and the resin is critical for long term reliability of the printed circuit or IC substrate. The MacDermid Enthone brand has a portfolio of different copper surface treatments to meet the needs of any application. To compliment the expanding use of low-profile copper foils for high frequency applications, we also provide surface treatment options that are designed specifically for high speed/low-loss applications. MacDermid Enthone’s products are specifically engineered to provide robust reliability across a wide range of resin systems and copper foil types, and can meet the system requirements for any application type. Product Features High reliability innerlayer bonding on a wide variety of materials Prepares copper surfaces for optimum efficiency Compatible with a full range of resins Complete offering of surface treatment systems Signal integrity/low loss for high speed applications

A wide portfolio of chemical treatments for the copper surfaces that make up the circuitry of printed circuit boards and IC substrates.

Product Overview

Adhesion between the innerlayer copper circuits and the resin is critical for long term reliability of the printed circuit or IC substrate. The MacDermid Enthone brand has a portfolio of different copper surface treatments to meet the needs of any application. To compliment the expanding use of low-profile copper foils for high frequency applications, we also provide surface treatment options that are designed specifically for high speed/low-loss applications. MacDermid Enthone’s products are specifically engineered to provide robust reliability across a wide range of resin systems and copper foil types, and can meet the system requirements for any application type.


Product Features

  • High reliability innerlayer bonding on a wide variety of materials
  • Prepares copper surfaces for optimum efficiency
  • Compatible with a full range of resins
  • Complete offering of surface treatment systems
  • Signal integrity/low loss for high speed applications
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Name Copper Adhesion Promotion
Industry Semiconductors, IC's
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