Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.
Product Overview
ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment of Sn-Pb Eutectic or Pb-free spheres onto BGA, CSP or wafer level components. It is compatible with Cu-UBM, Cu-OSP, electrolytic Ni-Au and ENIG pad finishes.
Features
Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
Excellent wettability: Excellent activity reduces the occurrence of dark balls
Excellent cleanability: Flux residues are removed easily with warm DI water
High tackiness allows high yields for wafer level ball attach
Water soluble paste flux for wafer level ball attach on both Fan-in and Fan-out applications.
Product Overview
ALPHA WS9160-M7 water soluble flux is engineered to be used in the attachment of Sn-Pb Eutectic or Pb-free spheres onto BGA, CSP or wafer level components. It is compatible with Cu-UBM, Cu-OSP, electrolytic Ni-Au and ENIG pad finishes.
Features
- Excellent activity allows for excellent soldering to Cu UBM, Cu OSP and ENIG soldering process
- Excellent wettability: Excellent activity reduces the occurrence of dark balls
- Excellent cleanability: Flux residues are removed easily with warm DI water
- High tackiness allows high yields for wafer level ball attach
