Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance.
Product Overview
ALPHA WS-699CPS is a next generation water soluble solder paste specifically designed for fine pitch and high-density applications. ALPHA WS-699CPS broad processing window is designed for stencil printing for either surface mount or solder bumping processes.
ALPHA WS-699CPS is formulated to deliver an outstanding reflow process window with fine powder sizes such as Type 6 and 7 with excellent low voiding performance. It delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent slump resistance performance for fine pitch printing.
Features
Low voiding performance
Maximizes reflow yield for lead-free processing
Excellent print consistency with high process capability index
Reduction in random solder balling levels, minimizing rework and increasing first time yield
Water soluble, lead-free solder paste capable of 50um aperture printing performance with low voiding and excellent soldering and residue cleaning performance.
Product Overview
ALPHA WS-699CPS is a next generation water soluble solder paste specifically designed for fine pitch and high-density applications. ALPHA WS-699CPS broad processing window is designed for stencil printing for either surface mount or solder bumping processes.
ALPHA WS-699CPS is formulated to deliver an outstanding reflow process window with fine powder sizes such as Type 6 and 7 with excellent low voiding performance. It delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes and excellent slump resistance performance for fine pitch printing.
Features
- Low voiding performance
- Maximizes reflow yield for lead-free processing
- Excellent print consistency with high process capability index
- Reduction in random solder balling levels, minimizing rework and increasing first time yield
