ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance.
Product Overview
ALPHA WS-698 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-698 is a halogen-free compliant material with high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
Features
Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
Excellent cleanability performance in that residues are easily cleaned with DI water
ALPHA WS-698 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes and enables low voiding performance.
Product Overview
ALPHA WS-698 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-698 is a halogen-free compliant material with high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
Features
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water
