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MacDermid Alpha Electronics Solutions ALPHA ® WS-630

Description
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield. ALPHA WS-630 is also compatible with laser assisted bonding processes. Features Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates Excellent cleanability performance in that residues are easily cleaned with DI water
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Suppliers

Company
Product
Description
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ALPHA ® WS-630 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® WS-630
ALPHA ® WS-630
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance. Product Overview ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield. ALPHA WS-630 is also compatible with laser assisted bonding processes. Features Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates Excellent cleanability performance in that residues are easily cleaned with DI water

ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance.

Product Overview

ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.

The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.

ALPHA WS-630 is also compatible with laser assisted bonding processes.


Features

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
  • Excellent cleanability performance in that residues are easily cleaned with DI water
Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Soldering Irons, Stations, and Accessories
Product Name ALPHA ® WS-630
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