ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance.
Product Overview
ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
ALPHA WS-630 is also compatible with laser assisted bonding processes.
Features
Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
Excellent cleanability performance in that residues are easily cleaned with DI water
ALPHA WS-630 is a water soluble high activity paste flux that delivers excellent solder wetting on challenging finishes and enables low voiding performance.
Product Overview
ALPHA WS-630 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.
The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-630 is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.
ALPHA WS-630 is also compatible with laser assisted bonding processes.
Features
- Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
- Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates
- Excellent cleanability performance in that residues are easily cleaned with DI water