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MacDermid Alpha Electronics Solutions ALPHA ® WS-608

Description
ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance. Product Overview ALPHA WS-608 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-608 can be used as a pre-cleaning flux for oxidized Cu-OSP boards. Its high activity formulation allows it to also be used as a single-step ball attach flux on Cu-OSP boards. It is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield. Features Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach yield rates Excellent cleanability performance in that residues are easily cleaned with DI water
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Suppliers

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Product
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ALPHA ® WS-608 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® WS-608
ALPHA ® WS-608
ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance. Product Overview ALPHA WS-608 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-608 can be used as a pre-cleaning flux for oxidized Cu-OSP boards. Its high activity formulation allows it to also be used as a single-step ball attach flux on Cu-OSP boards. It is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield. Features Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process Superior wetting maximizing assembly yields to provide highest ball attach yield rates Excellent cleanability performance in that residues are easily cleaned with DI water

ALPHA WS-608 is a water soluble high activity paste flux which delivers excellent solder wetting on challenging finishes, excellent cleaning and enables low voiding performance.

Product Overview

ALPHA WS-608 water soluble flux is engineered to be used in the soldering of a variety of lead-free and tin-lead eutectic alloys onto area array packages.

The flux is highly compatible with Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS-608 can be used as a pre-cleaning flux for oxidized Cu-OSP boards. Its high activity formulation allows it to also be used as a single-step ball attach flux on Cu-OSP boards. It is a halogen-free compliant material with very high fluxing activity for performance advantages in the areas of wetting, spread, and missing ball rate/yield.


Features

  • Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process
  • Superior wetting maximizing assembly yields to provide highest ball attach yield rates
  • Excellent cleanability performance in that residues are easily cleaned with DI water
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Soldering Irons, Stations, and Accessories
Product Name ALPHA ® WS-608
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