ALPHA OM-550 is a zero halogen, low temperature chemistry paired with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys.
Product Overview
ALPHA OM-550 HRL1 is a high reliability, low-temperature solder paste. The HRL1 alloy in this paste has a melting point significantly lower than SAC305 which will help to increase production yield and reduce component warpage.
Together, the flux and alloy combine to make a product that has the characteristics of a traditional solder paste used in high end CPUs but with the ability to reflow at lower temperatures therefore minimizing post reflow warpage induced defects.
Product Features
Low reflow peak temperature of 185 to 195 °C for mixed alloy process
Compatible with HRL1 alloy for comparable mechanical performance to SAC305 in the right application
Reduction of warpage induced defects compared to SAC reflow process
Excellent NWO & HiP Performance
Fine Feature Printing/Reflow capable
ALPHA OM-550 is a zero halogen, low temperature chemistry paired with the HRL1 alloy designed to offer improved drop shock and thermal cycling performance versus existing low temperature alloys.
Product Overview
ALPHA OM-550 HRL1 is a high reliability, low-temperature solder paste. The HRL1 alloy in this paste has a melting point significantly lower than SAC305 which will help to increase production yield and reduce component warpage.
Together, the flux and alloy combine to make a product that has the characteristics of a traditional solder paste used in high end CPUs but with the ability to reflow at lower temperatures therefore minimizing post reflow warpage induced defects.
Product Features
- Low reflow peak temperature of 185 to 195 °C for mixed alloy process
- Compatible with HRL1 alloy for comparable mechanical performance to SAC305 in the right application
- Reduction of warpage induced defects compared to SAC reflow process
- Excellent NWO & HiP Performance
- Fine Feature Printing/Reflow capable
