ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging.
Product Overview
ALPHA NCX-PRL507 epoxy flux is engineered for ball drop on wafer and flip chip attach processing. This halide & halogen-free epoxy flux allows a fully formed lead-free solder joint to occur prior to the formation of a polymer reinforcement layer (PRL) around the solder/pad interface. ALPHA NCX-PRL507 was specifically developed with a higher Tg to provide significant improvement to the drop shock and temperature cycling reliability performance of final assembled packages.
Features
Superior activity, wetting, and assembly yield rates
High Tg polymer reinforcement layer
Excellent material stability – maintains tack and viscosity over multiple print cycles
Improved ball shear strength, drop shock, and temperature cycle reliability performance
ALPHA NCX-PRL507 is an epoxy paste flux for wafer level ball attach for both Fan-in and Fan-out applications. It can also be used as a flip chip flux for wafer level packaging.
Product Overview
ALPHA NCX-PRL507 epoxy flux is engineered for ball drop on wafer and flip chip attach processing. This halide & halogen-free epoxy flux allows a fully formed lead-free solder joint to occur prior to the formation of a polymer reinforcement layer (PRL) around the solder/pad interface. ALPHA NCX-PRL507 was specifically developed with a higher Tg to provide significant improvement to the drop shock and temperature cycling reliability performance of final assembled packages.
Features
- Superior activity, wetting, and assembly yield rates
- High Tg polymer reinforcement layer
- Excellent material stability – maintains tack and viscosity over multiple print cycles
- Improved ball shear strength, drop shock, and temperature cycle reliability performance