No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance.
Product Overview
ALPHA NCP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications where high soldering activity, low voiding and clear flux residues are required.
This product is designed to enable consistent fine pitch printing capability down to 70μm stencil opening with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. ALPHA NCP-390 is also available as a dispensing solder paste for low voiding applications
Features
Excellent solder joint and flux residue cosmetics
Excellent voiding performance
Long stencil life: consistent performance for at least 8-hours of continuous printing
Robust tack force ensures high pick-and-place yields, good self-alignment
No clean, lead-free solder paste which meets zero-halogen requirements with low voiding, fine feature printing performance.
Product Overview
ALPHA NCP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications where high soldering activity, low voiding and clear flux residues are required.
This product is designed to enable consistent fine pitch printing capability down to 70μm stencil opening with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. ALPHA NCP-390 is also available as a dispensing solder paste for low voiding applications
Features
- Excellent solder joint and flux residue cosmetics
- Excellent voiding performance
- Long stencil life: consistent performance for at least 8-hours of continuous printing
- Robust tack force ensures high pick-and-place yields, good self-alignment
