ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers.
Product Overview
The low temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C. The flux residue from ALPHA JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
Product Features
Low temperature reflow profiles enables the use of low Tg PCB
Excellent deposit consistency with high process capability index across all board designs
Reduction in random solderballing levels
Excellent pin-test yield for single and double reflow
Available in Type 5 powder
ALPHA JP-501 is a low temperature, lead-free, no-clean solder paste designed for use in Jet Printers.
Product Overview
The low temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C. The flux residue from ALPHA JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
Product Features
- Low temperature reflow profiles enables the use of low Tg PCB
- Excellent deposit consistency with high process capability index across all board designs
- Reduction in random solderballing levels
- Excellent pin-test yield for single and double reflow
- Available in Type 5 powder
