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MacDermid Alpha Electronics Solutions ALPHA ® HiTech CF12-4485B Edgebond

Description
A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components. Product Overview ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories. It can be stored in non-freezing condition of 1 - 10°C. Product Features A lower cost option to conventional underfilling process with increased productivity and lower material volume required Long Pot Life of 7 days Excellent Adhesion on FR4 Halogen-free and complies with RoHS Directive 2015/863/EU
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Suppliers

Company
Product
Description
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ALPHA ® HiTech CF12-4485B Edgebond -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® HiTech CF12-4485B Edgebond
ALPHA ® HiTech CF12-4485B Edgebond
A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components. Product Overview ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories. It can be stored in non-freezing condition of 1 - 10°C. Product Features A lower cost option to conventional underfilling process with increased productivity and lower material volume required Long Pot Life of 7 days Excellent Adhesion on FR4 Halogen-free and complies with RoHS Directive 2015/863/EU

A one component, heat curable material to be dispensed on the corners of the BGA. The cured edgebond will help to strengthen the soldered assembled components.

Product Overview

ALPHA HiTech CF12-4485B end market is in portables such as Graphic Cards, Notebooks, Tablets, as well as assembled boards in Automotive and Medical accessories.

It can be stored in non-freezing condition of 1 - 10°C.


Product Features

  • A lower cost option to conventional underfilling process with increased productivity and lower material volume required
  • Long Pot Life of 7 days
  • Excellent Adhesion on FR4
  • Halogen-free and complies with RoHS Directive 2015/863/EU
Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Name ALPHA ® HiTech CF12-4485B Edgebond
Industry Semiconductors, IC's
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