ALPHA EF-8800HF is a halogen-free, high reliability, mid-solids, alcohol-based, no-clean wave soldering flux for standard and thick board applications.
Product Overview
ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density PCBs in leaded and lead-free process.
With special thermally stable activators in the formulation, this flux shows stable performance across different preheating temperatures and dwell times. It delivers exceptional hole-fill even under long exposure to higher preheat and higher solder pot temperature, thus delivering low bridging on bottom side QFPs, as well as provide superior performance in hole-fill and solderballing.
Additionally, ALPHA EF-8800HF provides good lead-free solder joint cosmetics with an evenly spread, tack-free residue, reducing defects in pin testing.
Product Features
Halogen-free
Wide process window
Robust soldering performance under high top-side preheat (>125⁰C), high pot temperatures (>270⁰C) and long dwell times (>7 seconds)
Excellent hole fill demonstrated on thick board
High reliability meeting the toughest ECM/SIR IPC 004B requirements
ORL0 per IPC J Std-004B
ALPHA EF-8800HF is a halogen-free, high reliability, mid-solids, alcohol-based, no-clean wave soldering flux for standard and thick board applications.
Product Overview
ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density PCBs in leaded and lead-free process.
With special thermally stable activators in the formulation, this flux shows stable performance across different preheating temperatures and dwell times. It delivers exceptional hole-fill even under long exposure to higher preheat and higher solder pot temperature, thus delivering low bridging on bottom side QFPs, as well as provide superior performance in hole-fill and solderballing.
Additionally, ALPHA EF-8800HF provides good lead-free solder joint cosmetics with an evenly spread, tack-free residue, reducing defects in pin testing.
Product Features
- Halogen-free
- Wide process window
- Robust soldering performance under high top-side preheat (>125⁰C), high pot temperatures (>270⁰C) and long dwell times (>7 seconds)
- Excellent hole fill demonstrated on thick board
- High reliability meeting the toughest ECM/SIR IPC 004B requirements
- ORL0 per IPC J Std-004B
