Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach
Product Overview
ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.
Specifically designed as a film solution for wafer lamination for die attach onto bare copper surfaces, ALPHA Argomax 8035 innovative film provides a solution at the wafer level, providing customers with die pre-laminated with ALPHA Argomax.
Processing (lamination, dicing, pick-up) of ALPHA Argomax 8035 may vary based on die size, wafer thickness and type etc.
Contact us to discuss your specific application.
Product Features
Designed specifically for wafer dicing after lamination with dicing tape
Formulated for Cu surface die attach
Film can be cut to custom sizes
Pure silver bond line for high performance and reliability
High thermal and electrical conductivity
Low sintering pressure for high yield manufacturing
Die attach temperatures suitable for semiconductor manufacturing
Sinter Silver Film for Die Attachment – Wafer Level Processing with Copper surface Die attach
Product Overview
ALPHA Argomax 8035 Film is a low-pressure silver sintering die attach film from Alpha. It is specially designed for application at wafer level and is particularly suited for high volume die attach of power discrete on leadframes.
Specifically designed as a film solution for wafer lamination for die attach onto bare copper surfaces, ALPHA Argomax 8035 innovative film provides a solution at the wafer level, providing customers with die pre-laminated with ALPHA Argomax.
Processing (lamination, dicing, pick-up) of ALPHA Argomax 8035 may vary based on die size, wafer thickness and type etc.
Contact us to discuss your specific application.
Product Features
- Designed specifically for wafer dicing after lamination with dicing tape
- Formulated for Cu surface die attach
- Film can be cut to custom sizes
- Pure silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
- Die attach temperatures suitable for semiconductor manufacturing
