Tight particle size distribution
Blocky and etched surface
Stringent oversize control
Surfaces cleaned to extremely low levels of elemental impurities and ionic content
Specific feed crystal source and monitoring
Majority of sizes are from or proprietary Mesh-to-Micron process
The above characteristics make this line the perfect product for High Pressure/High Temperature, semiconductor and microelectronics applications. MDP(N) is also used in wheel fabrication and high precision lapping and polishing applications.
- Tight particle size distribution
- Blocky and etched surface
- Stringent oversize control
- Surfaces cleaned to extremely low levels of elemental impurities and ionic content
- Specific feed crystal source and monitoring
- Majority of sizes are from or proprietary Mesh-to-Micron process
The above characteristics make this line the perfect product for High Pressure/High Temperature, semiconductor and microelectronics applications. MDP(N) is also used in wheel fabrication and high precision lapping and polishing applications.
